# ASIC 芯片 · 日跟踪 · 2026-10-22

> 日期：2026-10-22（Asia/Shanghai，周四）。窗口：2026-10-21（周三）早报之后 → 2026-10-22（周四）早。上一成功早报 **2026-10-21**。抓取全库：Saved 268 / skipped 28 / errors 46；blocked_hosts：community.hpe.com、docs.redhat.com、e.huawei.com、support.huawei.com、www.globenewswire.com、www.reddit.com、www.sangfor.com（与 10-21 相同）。相对全部历史归档真正新增 URL 15 条（industry 6、redhat 4、nutanix 3、smartx 1、zstack 1）。

## 摘要
- **本日无 ASIC 新品稿。** 旁证：BlueField-4 DPU 作 agent 安全执行点；NVIDIA 供应链目标（基板 2.5 倍、中介层 4 倍、测试 2 倍、CPO 光引擎 15→30 倍）——**厂商目标经媒体**。

## 原文摘录
### 1
- 归档：`archive/2026-10-22/industry/nvidia-gtc-berlin-2026-nvidia-intros-dsx-pods-and-more-7f26230e.txt`
- URL：https://www.servethehome.com/nvidia-gtc-berlin-2026-nvidia-intros-dsx-pods-and-more/
- 口径：厂商目标经媒体

> Advanced Packaging: a 4x increase in interposer wafers from Amkor by the end of 2028. - Testing: a 2x capacity increase by 2027 at KYEC. - Co-packaged optics: a whopping 15x increase in capacity of optical engines for co-packaged optics from SPIL. And doubling that again to a 30x increase by the end of 2028. Among these, the optics announcement is especially significant since NVIDIA is moving heavily into…